Summary:Low dielectric foam is a type of foam material that exhibits...
Low dielectric foam is a type of foam material that exhibits a low dielectric constant, making it an ideal choice for electronic applications where signal transmission and electromagnetic interference (EMI) are crucial.
Low dielectric foam is a type of foam material that has a low dielectric constant, typically less than 1.5. This means that it has a low ability to store electrical energy and can minimize signal loss and distortion. Low dielectric foam is typically made from polymeric materials, such as polyethylene or polyurethane, which are highly insulating and have low loss tangent.
Low dielectric foam offers several benefits, making it an attractive choice for various applications. One of the significant benefits is its ability to reduce signal loss and improve signal integrity. This makes it ideal for high-speed digital applications, where even minor distortions in signals can lead to errors or data corruption.
Low dielectric foam also provides excellent EMI shielding, which is crucial for electronics operating in environments with high electromagnetic interference. It reduces the amount of unwanted noise that can interfere with signals and disrupt performance.
Another significant advantage of low dielectric foam is its cost-effectiveness. Compared to traditional materials used in electronics, such as ceramics or metals, low dielectric foam is relatively inexpensive, making it an attractive option for manufacturers looking to reduce costs without sacrificing performance.
Cascell® HF foam core has been specifically designed for antenna application, due to its extremely low dielectric constants and particularly favorable transmission properties. It can also be used as structural core for radomes and mammography plates.
Processing and production
With an extremely fine closed-cell structure, the foam has minimal resin uptake and problem-free compatibility with metallic facing materials due to the absence of corrosive effects.
Cascell ® HF foam is suitable for hand lay-up, prepreg processing and vacuum infusion at temperature up to 130°C and pressure up to 0.3 MPa.