Development of low density paste adhesive with PMI foam splicing


PMI foam is a material that is currently developing in […]

PMI foam is a material that is currently developing in polymer foam core, has a small density, excellent high temperature resistance, low dielectric constant, and better fatigue resistance, and high resistance to voltage resistance, and has a wide range of advantages. Core materials for composite sandwich structures are widely used in high-speed trains, ships and aerospace.


The size and shape of the finished PMI foam material is limited to the overall molding of the sandwich structure, and the PMI foam material is spliced ​​and filling reinforcement is inevitable. Existing honeycomb replenishment with foam adhesive materials, although low density, high temperature and high strength requirements, still cannot meet the process requirements of normal temperature splicing of PMI foam.



The existing low-density paste adhesive material, although the process requirements for the normal temperature splicing of PMI foams, but cannot achieve forming processes for co-solidification with composite material prepreg, and their heat resistance is not designed. This study uses alicyclic amines / aromatic amines as a compound curing agent, prepared low-density paste adhesive has the advantage of normal temperature splicing, medium temperature and high temperature can be cured, fully satisfied with EP prepreg 1 PMI Process requirements for the heat pressing tank of the foam sandwich structure.


The adhesive reaches a better balance in density, heat resistance, mechanical properties and process performance, and fills the research gap in this area, and further broadens the application range of the PMI foam sandwich structural parts in the field of aerospace. It is of great significance.